Detailed Product Description

Multilayers PCB
Single, Double & Multilayers PCBs up to 16 Layers.
We Provide High Quality Multilayer PCBs fulfilling ISO9001 SGS system certification standard and UKAS quality management. achieving the PCB with technical data highlighted below:
A. Technology :
1. FR4 CEM-1 CEM-3 : Ni/Au, Hot Air Leveling;
2. more than double Layer: HAL equal electroplating or chemical nickel / gold, Hot Air Leveling (spray-tin), Gold-Finger Plating, Desmear.

B. The production capacity (double to 10 Layers) : Two Layer 10000-15000 square meter per month to more than four layers 6000-8000 square meter per month

C. Production leadtime:
Single-Layer: 3 days,
Double Layer: 5-7 days,
Four Layers: 7-8 Days,
More than Six Layer: 10 Days

D. Quality policy : The pursuit of excellent quality, zero-defect goal and providing satisfactory service.

E.Technical Data Achieved:
1. Layers : 1-10 layer
2. Maximum Board Size: 450*600cm 18*24 inch
3. Minimum Board Thickness:
4 layer 0.60mm 24mil,
6 layer 1.00mm 40mil,
8 layer 1.20mm 48mil,
10 layer 1.50mm 60mil
4. Minimum Line Width: 0.10mm 4mil
5. Minimum space : 0.10mm 4mil
6. Minimum hole size : 0.30mm 12mil
7. PTH wall thickness: 18um
8. PTH hole diameter tolerance: +/-0.10mm 4mil
9. Non PTH hole dia.Tolerance : +/-0.05mm 2mil
10. Hole position deviation: +/-0.05mm 2mil
11. Out line tolerance: +/-0.15mm 6mil
12. Minimum S/M Bridge: +/-0.1mm 4mil
13. Twist and Bent : less or equal to 1.0%
14. Insulation resistance: Normal 1MM ohm
15. Through hole resistance: less than 300 ohm Normal
16. Electric Strength : greater than 1.3KV per mm
17. Current breakdown : 10A
18. Peel Strength : 1.4N per mm
19. Solder mask abrasion: greater than 4H
20. Thermal Stress: 288 deg C 20 Sec
21. Flammability : 94V-0
22. Test Voltage: 50 to 300V

F. Major Equipment List:
1. Pre-Production: CAD/CAM, Laser photoplotter,Developer,Exposure Unit
2. Cut Sheet: Cut Sheet Machine, Oven
3. Inner Image Transfer/Etching : Scrubbing Machine, Auto printing Machine , Oven, Exposure,Developer,Ink Stripping & Etching Machine
4. (AOI) Inner inspector :Auto Optical Inspector
5. Black oxide: Auto Black Oxide line Oven
6. Lamination: Auto Vacuum Presser
7. Drilling: Out registration Drill, CNC Drilling Machine
8. Desmear & PTH : Deburring Machine, Auto.Desmear & PTH
9. Circuit Imaging : Scrubbing Machine,Dry Film Laminator, (ORC)Exposure, Developer
10. Pattern Plating: Plating line
11. Etching/stripping: D/F Stripper Etcher & T/L Stripper Machine
12. W.F Solder Mask / Legend :Scrubbing/Auto Printing Machine/Exposer/Developer/Oven
13. Nickel/Gold Electroless: Electroless Nickel/Gold Plating Line
14. Gold-Finger Plating
15. Hot-Air Levelling : HAL Machine
16. Profiling: Punching Machine,CNC Routing Machine,V-cut Machine,(150v)E-Tester
17. E-Testing: E-Tester
18. Organic Coating: Organic Coating Line
19. Chemical and Physical Laboratory:Impedance Test Systsm, X-ray Thickness Measure M/C, Microscope

Enquiries and Samples Pilot run from worldwide customers welcome