Detailed Product Description

Single, Double & Multilayers PCBs up to 16 Layers.
We Provide High Quality Multilayer PCBs fulfilling ISO9001 SGS system certification standard and UKAS quality management. achieving the PCB with technical data highlighted below:
A. Technology : 
     1. FR4 CEM-1 CEM-3 : Ni/Au, Hot Air Leveling;
     2. more than double Layer: HAL equal electroplating or chemical nickel / gold, Hot Air Leveling (spray-tin), Gold-Finger Plating, Desmear. 

B. The production capacity (double to 10 Layers) : Two Layer 10000-15000 square meter per month to more than four layers 6000-8000 square meter per month 

C. Production leadtime: 
Single-Layer: 3 days, 
Double Layer: 5-7 days,
Four Layers: 7-8 Days, 
More than Six Layer: 10 Days

D. Quality policy : The pursuit of excellent quality, zero-defect goal and providing satisfactory service.

E.Technical Data Achieved:
1. Layers : 1-10 layer
2. Maximum Board Size: 450*600cm  18*24 inch
3. Minimum Board Thickness:
   4 layer 0.60mm 24mil, 
   6 layer 1.00mm 40mil,
   8 layer 1.20mm 48mil,
   10 layer 1.50mm 60mil
4. Minimum Line Width: 0.10mm 4mil
5. Minimum space : 0.10mm 4mil
6. Minimum hole size : 0.30mm 12mil
7. PTH wall thickness: 18um
8. PTH hole diameter tolerance: +/-0.10mm 4mil
9. Non PTH hole dia.Tolerance : +/-0.05mm 2mil
10. Hole position deviation: +/-0.05mm 2mil
11. Out line tolerance: +/-0.15mm 6mil
12. Minimum S/M Bridge: +/-0.1mm 4mil
13. Twist and Bent : less or equal to 1.0%       
14. Insulation resistance: Normal 1MM ohm
15. Through hole resistance: less than 300 ohm   Normal
16. Electric Strength : greater than 1.3KV per mm
17. Current breakdown : 10A
18. Peel Strength : 1.4N per mm
19. Solder mask abrasion: greater than 4H               
20. Thermal Stress: 288 deg C 20 Sec
21. Flammability : 94V-0
22. Test Voltage: 50 to 300V

F. Major Equipment List: 
1.  Pre-Production: CAD/CAM, Laser  photoplotter,Developer,Exposure Unit 
2.  Cut  Sheet: Cut Sheet Machine, Oven
3.  Inner  Image Transfer/Etching : Scrubbing  Machine, Auto printing Machine , Oven, Exposure,Developer,Ink Stripping & Etching Machine
4.  (AOI) Inner  inspector :Auto  Optical  Inspector
5.  Black oxide: Auto Black Oxide line Oven
6.  Lamination: Auto Vacuum  Presser
7.  Drilling: Out  registration  Drill, CNC  Drilling  Machine
8. Desmear  &  PTH : Deburring  Machine, Auto.Desmear  & PTH
9. Circuit  Imaging  : Scrubbing  Machine,Dry   Film  Laminator, (ORC)Exposure, Developer
10. Pattern  Plating: Plating  line
11. Etching/stripping: D/F  Stripper  Etcher & T/L Stripper  Machine
12. W.F Solder Mask / Legend :Scrubbing/Auto Printing    Machine/Exposer/Developer/Oven
13. Nickel/Gold Electroless: Electroless Nickel/Gold Plating Line
14. Gold-Finger Plating
15. Hot-Air  Levelling : HAL Machine
16. Profiling: Punching  Machine,CNC Routing Machine,V-cut Machine,(150v)E-Tester
17. E-Testing: E-Tester
18. Organic  Coating: Organic  Coating  Line
19.  Chemical and Physical Laboratory:Impedance Test Systsm, X-ray Thickness Measure  M/C, Microscope 

Enquiries and Samples Pilot run from worldwide customers welcome.